1. frequency technologies are also increasing continually.

1.  Introduction

Fraunhofer IFAM:

We Will Write a Custom Essay Specifically
For You For Only $13.90/page!

order now

The Institute Fraunhofer Institute for Manufacturing Technology and Advanced
Materials IFAM is one of the leading research institute in Europe adhesive bonding
technology, surfaces, shaping and functional materials. IFAM is located in five
major cities in Germany namely, Bremen, Dresden, Oldenburg, Stade and Wolfsburg.
IFAM consists of more than 600 employees working in 23 departments. Their core
competencies includes Powder Technology; Sintered, Composite, and Cellular
Metallic Materials; Adhesive Bonding Technology; Surface Technology; Casting
Technology; Electrical Components and Systems; and Fibre Reinforced Plastics. IFAM provides products,
process and technical solution to sectors aviation industry, automotive sector,
energy and environment, medical technology and life sciences. IFAM Dresden branch is specialised in composite,
gradient materials, functional materials and highly porous metal.


state of the technology:


the recent times mobile phones, wireless communication technology for
transmitting text and image data is constantly making rapid progress. At the same
time, applications for broadband and high frequency technologies are also
increasing continually.  For further
progress in high frequency wireless communication technologies, mobile terminal
devices should be equipped with multiple functions such as Bluetooth, GPS, and
wireless LAN. This in turn results in Increasing the circuit size.  To overcome this, it is desirable to build
the various high frequency functions and passive components into the substrate itself
rather than mounting them on its surface.




Low temperature co-fired ceramics (LTCC) is an well-established technology to
produce highly integrated components and module for broadband and high
frequency technologies. It can be integrated with passive circuits and 3-dimensional
structures as well as to act as a reliable platform for integrated circuit (IC)
assembly. In addition to its excellent integration capacity, it’s possible to combine
materials with different electrical properties in one substrate to produce
multi-material modules.


LTCC Manufacturing


On the
other hand, there are many technical and industrial challenges still to overcome
before complex LTCC modules with three dimensional structures and integrated
functional materials can be efficiently produced.


I'm Alfred!

Would you like to get a custom essay? How about receiving a customized one?

Check it out